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 PRELIMINARY TECHNICAL DATA
=
16-/32- Channel, Serially Controlled 4 1.8 V to 5.5 V, 2.5 V, Analog Multiplexers ADG725/ADG731 Preliminary Technical Data
FUNCTIONAL BLOCK DIAGRAMS
ADG731
S1
FEATURES 3-Wire SPI Serial Interface 1.8 V to 5.5 V Single Supply 2.5 V Dual Supply Operation 4 On Resistance 0.5 On Resistance Flatness 7mm x 7mm 48 lead Chip Scale Package (CSP) or 48 lead TQFP package. Rail to Rail Operation Power On Reset Fast Switching Times Single 32 to 1 Channel Multiplexer Dual/Differential 16 to 1 Channel Multiplexer TTL/CMOS Compatible Inputs For Functionally Equivalent devices with Parallel Interface See ADG726/ADG732 APPLICATIONS Optical Applications Data Acquisition Systems Communication Systems Relay replacement Audio and Video Switching Battery Powered Systems Medical Instrumentation Automatic Test Equipment GENERAL DESCRIPTION
ADG725
S1A DA
S16A
D
S1B DB
S32
INPUT SHIFT REGISTER
S16B
INPUT SHIFT REGISTER
SCLK DIN SYNC
SCLK DIN SYNC
The ADG725/ADG731 are monolithic CMOS 32 channel/dual 16 channel analog multiplexers with a serially controlled 3-wire interface. The ADG732 switches one of thirty-two inputs (S1-S32) to a common output, D. The ADG725 can be configured as a dual mux switching one of sixteen inputs to one output or a differential mux switching one of sixteen inputs to a differential output. These mulitplexers utilize a 3-wire serial interface that is compatible with SPITM, QSPITM, MICROWIRETM and some DSP interface standards. On power-up, the internal shift register contains all zeros and all switch are in the OFF state. These multiplexers are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on resistance and leakage currents. They operate from single supply of 1.8V to 5.5V and 2.5 V dual supply, making them ideally suited to a variety of applications. On resistance is in the region of a few Ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either Multiplexers or De-Multiplexers REV. PrD May 2002
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
and have an input signal range which extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break before make switching action preventing momentary shorting when switching channels. They are available in either 48 lead CSP or TQFP package.
PRODUCT HIGHLIGHTS
1. 2.
3-Wire Serial Interface. +1.8 V to +5.5 V Single or 2.5 V Dual Supply operation. These parts are specified and guaranteed with +5 V 10%, +3 V 10% single supply and 2.5 V 10% dual supply rails. On Resistance of 4 . Guaranteed Break-Before-Make Switching Action. 7mm x 7mm 48 lead Chip Scale Package (CSP) or 48 lead TQFP package.
3. 4. 5.
One Technology Way, P Box 9106, Norwood, MA 02062-9106, U.S.A. .O. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2002
PRELIMINARY TECHNICAL DATA
ADG725/ADG731-SPECIFICATIONS1(V
Parameter ANALOG SWITCH Analog Signal Range On-Resistance (RON) On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) ADG725 ADG731 Channel ON Leakage ID, IS (ON) ADG725 ADG726 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION
2
DD
= 5V 10%, VSS = 0V, GND = 0 V, unless otherwise noted)
B Version -40C +25oC to +85C 0 V to VDD 4 5.5 6 0.3 0.8 1 0.01 0.25 0.05 0.5 1 0.05 0.5 1
Units V
Test Conditions/Comments
0.5
typ max typ max typ max typ max typ max max typ max max
VS = 0 V to VDD, IDS = 10 mA; Test Circuit 1 VS = 0 V to VDD , IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA VDD = 5.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V; Test Circuit 2 VD = 4.5 V/1 V, VS = 1 V/4.5 V; Test Circuit 3 VD = VS = 1 V, or 4.5V; Test Circuit 4
0.5 2.5 5 2.5 5 2.4 0.8
nA nA nA nA nA nA nA nA
V min V max A typ A max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ VIN = VINL or VINH
0.005 0.1 5 40 60 30 1 5 -60 -60
Break-Before-Make Time Delay, tD Charge Injection Off Isolation Channel to Channel Crosstalk -3 dB Bandwidth ADG725 ADG731 C S (OFF) C D (OFF) ADG725 ADG731 CD, CS (ON) ADG725 ADG731 POWER REQUIREMENTS IDD
RL = 300 , CL = 35 pF,Test Circuit 5; VS1 = 3 V/0 V, VS32 = 0 V/3V RL = 300 , CL = 35 pF; VS = 3 V, Test Circuit 6 VS = 0 V, RS = 0 , CL = 1 nF; Test Circuit 7 RL = 50 , CL = 5 pF, f = 100 kHz; Test Circuit 8 RL = 50 , CL = 5 pF, f = 100 kHz; Test Circuit 9 RL = 50 , CL = 5 pF, Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz VDD = +5.5 V Digital Inputs = 0 V or +5.5 V
34 18 13 180 360 200 400 10 20
MHz typ MHz typ pF typ pF typ pF typ pF typ pF typ A typ A max
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
-2-
REV. PrD
PRELIMINARY TECHNICAL DATA
SPECIFICATIONS
Parameter ANALOG SWITCH Analog Signal Range On-Resistance (R ON)
1(VDD = 3V 10%, VSS = 0V, GND = 0 V, unless otherwise noted)
B Version -40C +25oC to +85C 0 V to VDD 7 11 12 0.4 1 3 Units V
ADG725/ADG731
Test Conditions/Comments
On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage ID (OFF) ADG725 ADG731 Channel ON Leakage ID, IS (ON) ADG725 ADG731 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH C IN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION
2
typ max typ max max typ max typ max max typ max max
VS = 0 V to VDD, IDS = 10 mA; Test Circuit 1 VS = 0 V to VDD , IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V; Test Circuit 2 VS = 1 V/3 V, VD = 3 V/1 V; Test Circuit 3 VS = VD = +1 V or +3 V; Test Circuit 4
0.01 0.25 0.05 0.5 1 0.05 0.5 1
0.5 2.5 5 2.5 5 2.0 0.8
nA nA nA nA nA nA nA nA
V min V max A typ A max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ VIN = VINL or VINH
0.005 0.1 5 45 75 30 1 5 -60 -60
Break-Before-Make Time Delay, t D Charge Injection Off Isolation Channel to Channel Crosstalk -3 dB Bandwidth ADG725 ADG731 C S (OFF) C D (OFF) ADG725 ADG731 CD, CS (ON) ADG725 ADG731 POWER REQUIREMENTS IDD
RL = 300 , CL = 35 pF Test Circuit 5 VS1 = 2 V/0 V, VS32 = 0 V/2 V RL = 300 , CL = 35 pF; VS = 2 V, Test Circuit 6 VS = 0 V, RS = 0 , CL = 1 nF; Test Circuit 7 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 8 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 9 RL = 50 , CL = 5 pF, Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz VDD = +3.3 V Digital Inputs = 0 V or +3.3 V
34 18 13 180 360 200 400 10 20
MHz typ MHz typ pF typ pF typ pF typ pF typ pF typ A typ A max
NOTES 1 Temperature ranges are as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
REV. PrD
-3-
PRELIMINARY TECHNICAL DATA
ADG725/ADG731-SPECIFICATIONS1 Dual Supply (V = +2.5 V 10%, V = -2.5 V 10%, GND = 0 V, unless otherwise noted)
DD SS
Parameter ANALOG SWITCH Analog Signal Range On-Resistance (R ON) On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON)
B Version -40C +25oC to +85C VSS to VDD 4 5.5 6 0.3 0.8 1 0.01 0.25 0.05 0.5 1 0.01 0.5 1
Units V
Test Conditions/Comments
0.5
typ max typ max typ max typ max typ max max typ max max
VS = VSS to VDD, IDS = 10 mA; Test Circuit 1 VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA VDD = +2.75 V, VSS = -2.75 V VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; Test Circuit 2 VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; Test Circuit 3 VS = VD = +2.25 V/-1.25 V, Test Circuit 4
0.5 2.5 5 2.5 5 1.7 0.7
nA nA nA nA nA nA nA nA
DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH C IN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION
2
V min V max A typ A max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ VIN = VINL or VINH
0.005 0.1 5 40 60 15 1 8 -60 -60
Break-Before-Make Time Delay, t D Charge Injection Off Isolation Channel to Channel Crosstalk -3 dB Bandwidth ADG725 ADG731 C S (OFF) C D (OFF) ADG725 ADG731 CD, CS (ON) ADG725 ADG731 POWER REQUIREMENTS IDD ISS
RL = 300 , CL = 35 pF Test Circuit 5 VS1 = 1.5 V/0 V,VS32 = 0 V/1.5 V RL = 300 , CL = 35 pF; VS = 1.5 V, Test Circuit 6 VS = 0 V, RS = 0 , CL = 1 nF; Test 7 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 8 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 9 RL = 50 , CL = 5 pF, Test Circuit 10
34 18 13 180 360 200 400 10 20 10 20
MHz typ MHz typ pF typ pF typ pF typ pF typ pF typ A A A A typ max typ max
f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz VDD = +2.75 V Digital Inputs = 0 V or +2.75 V VSS = -2.75 V Digital Inputs = 0 V or +2.75 V
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
-4-
REV. PrD
PRELIMINARY TECHNICAL DATA ADG725/ADG731
TIMING CHARACTERISTICS1,2
Parameter t1 t2 t3 t4 t5 t6 t7 t8 Limit at TMIN, TMAX 33 13 13 13 40 5 4.5 33 Units ns ns ns ns ns ns ns ns min min min min min min min min Conditions/Comments SCLK Cycle time SCLK High Time SCLK Low Time SYNC to SCLK falling edge setup time Minimum SYNC low time Data Setup Time Data Hold Time Minimum SYNC high time
NOTES 1 See Figure 1. 2 All input signals are specified with tr =tf = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. Specifications subject to change without notice.
t1 SCLK t8 SYNC t2 t4 t5 t6 DIN DB7 t7 DB0 t3
Figure 1. 3-Wire Serial Interface Timing Diagram.
DB7 (MSB) EN CSA CSB X A3 A2
DB0 (LSB) A1 A0
DB7 (MSB) EN CS X A4 A3 A2
DB0 (LSB) A1 A0
DATA BITS
DATA BITS
Figure 2. ADG725 Input Shift Register Contents
Figure 3. ADG731 Input Shift Register Contents
REV. PrD
-5-
PRELIMINARY TECHNICAL DATA ADG725/ADG731
ABSOLUTE MAXIMUM RATINGS 1
(TA = +25C unless otherwise noted)
VDD to VSS VDD to GND VSS to GND Analog Inputs2
+7 V -0.3 V to +7 V +0.3 V to -7 V VSS - 0.3 V to VDD +0.3 Vor 30 mA, Whichever Occurs First Digital Inputs 2 -0.3V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D 60mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D 30mA Operating Temperature Range Industrial (B Version) -40C to +85C
Storage Temperature Range -65C to +150C Junction Temperature +150C TBDC/W 48 lead CSP JA Thermal Impedance 48 lead TQFP JA Thermal Impedance TBDC/W Lead Temperature, Soldering (10seconds) 300C IR Reflow, Peak Temperature +220C
NOTES 1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at SCLK, SYNC, DIN, RS, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG725/ADG731 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Model ADG725BCP ADG725BSU ADG731BCP ADG731BSU
Temperature Range -40 -40 -40 -40
o o
Package Description Chip Thin Chip Thin Scale Quad Scale Quad Package (CSP) Flatpack Package (CSP) Flatpack
Package Option CP-48 SU-48 CP-48 SU-48
C C o C o C
to to to to
+85 +85 +85 +85
o o
C C o C o C
-6-
REV. PrD
PRELIMINARY TECHNICAL DATA ADG725/ADG731
PIN FUNCTION DESCRIPTION
ADG725
ADG731
Mnemonic Function SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. These devices can accomodate serial input rates of up to 30MHz. Active low control input that clears the input register and turns all switches to the OFF condition. Serial Data Input. Data is clocked into the 8-bit input register on the falling edge of the serial clock input. Source. May be an input or output. Drain. May be an input or output. Power Supply Input. These parts can be operated from a supply of +1.8V to +5.5V and dual supply of +/-2.5V. Ground reference. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers on the SCLK and DIN buffers and the input shift register is enabled. An 8-bit counter is also enabled. Data is transferred on the falling edges of the following clocks. After 8 falling clock edges, switch conditions are automaticaly updated. SYNC may be used to frame the signal, or just pulled low for a short period of time to enable the counter and input buffers.
PIN CONFIGURATIONS CSP & TQFP
RS DIN SXX DX VDD GND SYNC
S13A
S14A
S15A
S16A
S16A
S15B
S14B
S13
S14
S15
S16
S32
S31
S30
S29
NC
NC
NC
D
48 47 46 45 44 43 42 41 40 39 38 37
48 47 46 45 44 43 42 41 40 39 38 37 36 S28 35 S27 34 S26 33 S25 32 S24 31 S23 30 S22 29 S21 28 S20 27 S19 26 S18 25 S17
S12 1 S11 2 S10 3 S9 4 S8 5 S7 6 S6 7 S5 8 S4 9 S3 10 S2 11 S1 12 NC = NO CONNECT
S12A 1 S11A 2 S10A 3 S9A 4 S8A 5 S7A 6 S6A 7 S5A 8 S4A 9 S3A 10 S2A 11 S1A 12 NC = NO CONNECT
S13B
36 S12B 35 S11B 34 S10B 33 S9B 32 S8B 31 S7B 30 S6B 29 S5B 28 S4B 27 S3B 26 S2B 25 S1B
NC
DA DIN
NC
PIN 1 IDENTIFIER
PIN 1 IDENTIFIER
ADG731
TOP VIEW (Not to Scale)
ADG725
TOP VIEW (Not to Scale)
13 14 15 16 17 18 19 20 21 22 23 24
13 14 15 16 17 18 19 20 21 22 23 24
DB
GND
VDD VDD
NC
NC
NC
NC
NC
SYNC
SYNC
REV. PrD
SCLK
-7-
SCLK
DIN
GND
VDD VDD
VSS
VSS
NC
NC
NC
NC
NC
PRELIMINARY TECHNICAL DATA ADG725/ADG731
Table 1. ADG725 Truth Table
A3 X X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
A2 X X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
A1 X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
A0 X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
EN X 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
CSA CSB 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Switch Condition Retains previous switch condition All Switches OFF S1A - DA, S1B - DB S2A - DA, S2B - DB S3A - DA, S3B - DB S4A - DA, S4B - DB S5A - DA, S5B - DB S6A - DA, S6B - DB S7A - DA, S7B - DB S8A - DA, S8B - DB S9A - DA, S9B - DB S10A - DA, S10B - DB S11A - DA, S11B - DB S12A - DA, S12B - DB S13A - DA, S13B - DB S14A - DA, S14B - DB S15A - DA, S15B - DB S16A - DA, S16B - DB
Table 2. ADG731 Truth Table
A4 X X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
A3 X X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
A2 X X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
A1 X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
A0 X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
E N C S Switch Condition X 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Retains previous switch condition All Switches OFF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
X = Don't Care
-8-
REV. PrD
PRELIMINARY TECHNICAL DATA ADG725/ADG731
TERMINOLOGY
VDD VSS IDD ISS GND S D IN VD (VS) RON R ON RFLAT(ON) I S (OFF) I D (OFF) ID, IS (ON) VINL VINH IINL(IINH) C S (OFF) C D (OFF) C D ,C S (ON) CIN tTRANSITION tOPEN
Charge Injection Off Isolation A measure of unwanted signal coupling through an "OFF" switch. Crosstalk A measure of unwanted signal is coupled through from one channel to another as a result of parasitic capacitance. On Response The Frequency response of the "ON" switch. Insertion Loss The loss due to the ON resistance of the switch.
Most positive power supply potential. Most Negative power supply in a dual supply application. In single supply applications, connect to GND. Positive supply current. Negative supply current. Ground (0 V) reference. Source terminal. May be an input or output. Drain terminal. May be an input or output. Logic control input. Analog voltage on terminals D, S Ohmic resistance between D and S. On resistance match between any two channels, i.e. RONmax - RONmin Flatness is defined as the difference between the maximum and minimum value of on-resistance as mea sured over the specified analog signal range. Source leakage current with the switch "OFF." Drain leakage current with the switch "OFF." Channel leakage current with the switch "ON." Maximum input voltage for logic "0". Minimum input voltage for logic "1". Input current of the digital input. "OFF" switch source capacitance. Measured with reference to ground. "OFF" switch drain capacitance. Measured with reference to ground. "ON" switch capacitance. Measured with reference to ground. Digital input capacitance. Delay time measured between the 50% and 90% points of the SYNC and the switch "ON" condi tion when switching from one address state to another. "OFF" time measured between the 80% points of both switches when switching from one address state to another. A measure of the glitch impulse transferred from the digital input to the analog output during switching.
REV. PrD
-9-
PRELIMINARY TECHNICAL DATA ADG725/ADG731 TYPICAL PERFORMANCE CHARACTERISTICS
TBD
TBD
TBD
TPC 1. On Resistance vs. VD(VS) for for Single Supply
TPC 4. On Resistance vs. VD(VS) for Different Temperatures, Single Supply
TPC 7. Leakage Currents vs. VD(VS)
TBD
TBD
TBD
TPC 2. On Resistance vs. VD(VS) for Dual Supply
TPC 5. On Resistance vs. VD(VS) for Different Temperatures, Dual Supply
TPC 8. Leakage Currents vs. VD(VS)
TBD
TBD
TBD
TPC 6. Leakage Currents vs. VD(VS) TPC 3. On Resistance vs. VD(VS) for Different Temperatures, Single Supply
TPC 9. Leakage Currents vs. Temperature
-10-
REV. PrD
PRELIMINARY TECHNICAL DATA ADG725/ADG731
TBD
TBD
TBD
TPC 10. Leakage Currents vs. Temperature
TPC 13. TON/TOFF Times vs. Temperature
TPC 16. On Response vs. Frequency
TBD
TBD
TPC 11. Supply Currents vs. Input Switching Frequency
TPC 14. Off Isolation vs. Frequency
TBD
TBD
TPC 12. Charge Injection vs. Source Voltage
TPC 15. Crosstalk vs. Frequency
REV. PrD
-11-
PRELIMINARY TECHNICAL DATA ADG725/ADG731
GENERAL DESCRIPTION
The ADG725 and ADG731 are serially controlled, 32 channel and dual/differential 16 channel multiplexers respectively.
POWER ON RESET
On power up of the device, all switches will be in the OFF condition and the internal shift register is filled with zeros and will remain so until a valid write takes place.
SERIAL INTERFACE
The ADG725 and ADG731 have a three wire serial interface (SYNC, SCLK, and DIN), which is compatible with SPI, QSPI, MICROWIRE interface standards and most DSP's. Figure 1 shows the timing diagram of a typical write sequence. Data is written to the 8-bit shift register via DIN under the control of the SYNC and SCLK signals. When SYNC goes low, the input shift register is enabled. An 8-bit counter is also enabled. Data from DIN is clocked into the shift register on the falling edge of SCLK. Figures 2 & 3 show the contents of the input shift registers for these devices. When the part has received eight clock cycles after SYNC has been pulled low, the switches are automatically updated with the new configuration and the input shift register is disabled. With SYNC held high, any further data or noise on the DIN line will have no effect on the shift register. The ADG725 CSA and CSB data bits allow the user the flexibility to change the configuration of either or both banks of the multiplexer.
-12-
REV. PrD
PRELIMINARY TECHNICAL DATA ADG725/ADG731 Test Circuits
I DS
VDD
V1
VSS V SS
V DD S1
S D
S2 S32
D
ID (OFF)
A
VS
VD GND
VS
R O N = V 1/IDS
Test Circuit 1. On Resistance.
VDD V DD S1 S2 VS VD S32 D
Test Circuit 3. ID (OFF)
VDD V DD S1 S32 VSS V SS D ID (ON) A VD VS GND
VSS V SS
IS (OFF)
GND
Test Circuit 2. IS (OFF).
VDD V DD VSS V SS S1 S2 THRU S31 ADG731* S32 D GND RL 300 CL 35pF VS32 VOUT V OUT VS32 * SIMILAR CONNECTION FOR ADG725 SYNC VS1 0V
Test Circuit 4. ID (ON)
50%
50%
VS1 90%
90% tTRANSITION tTRANSITION
Test Circuit 5. Switching Time of Multiplexer, tTRANSITION.
V DD VDD
VSS VSS S1 SYNC VS 0V
S2 THRU S31 ADG731* S32 D GND RL 300 CL 35pF VOUT
VS VOUT 80% 80%
t OPEN *SIMILAR CONNECTION FOR ADG725
Test Circuit 6. Break Before Make Delay, tOPEN.
REV. PrD
-13-
PRELIMINARY TECHNICAL DATA ADG725/ADG731
VDD V DD VSS VSS SYNC
ADG731* RS VS GND S D CL 1nF VOUT V OUT QINJ = CL x VOUT VOUT
*SIMILAR CONNECTION FOR ADG725
Test Circuit 7. Charge Injection.
VDD 0.1 F
VSS 0.1 F
VDD VSS
VDD S
VSS
NETWORK ANALYZER 50 VS VOUT
VDD VSS S1 S2 ADG731* S32
50
NETWORK ANALYZER 50 VS VOUT
50 D ADG731* GND
RL 50
D GND RL 50
OFF ISOLATION = 20 LOG *SIMILAR CONNECTION FOR ADG725
VOUT VS
*SIMILAR CONNECTION FOR ADG725 CHANNEL TO CHANNEL CROSSTALK= 20LOG 10(VOUT /VS)
Test Circuit 8. OFF Isolation
Test Circuit 9. Channel-to-Channel Crosstalk.
VDD 0.1 F
VSS 0.1 F NETWORK ANALYZER 50 VS D VOUT
VDD S
VSS
ADG731* GND
RL 50
INSERTION LOSS = 20 LOG
VOUT WITH SWITCH VOUT WITHOUT SWITCH
*SIMILAR CONNECTION FOR ADG725
Test Circuit 10. Bandwidth
-14-
REV. PrD
PRELIMINARY TECHNICAL DATA ADG725/ADG731
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
48-Lead CSP (CP-48)
0.276(7.0) BSC SQ PIN 1 INDICATOR 0.024 (0.60) 0.017 (0.42) 0.009 (0.24) 0.024 (0.60) 0.017 (0.42) 37 0.009 (0.24)
36
0.010 (0.25) MIN
48 1
TOP VIEW
0.266 (6.75) BSC SQ
BOTTOM VIEW
0.207 (5.25) 0.201 (5.10) SQ 0.195 (4.95)
0.020 (0.50) 0.016 (0.40) 0.012 (0.30) 12 MAX 0.035 (0.90) MAX 0.033 (0.85) NOM
o
25 24
12 13
0.217 (5.5) REF
0.028 (0.70) MAX 0.026 (0.65) NOM 0.002 (0.05) 0.0004 (0.01) 0.012 (0.30) 0.020 (0.50) 0.008(0.20) 0.0 (0.0) BSC 0.009 (0.23) REF 0.007 (0.18)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS
48-Lead TQFP (SU-48)
0.047 (1.20) MAX 0.041 (1.05) 0.037 (0.95)
48 1
0.354 (9.00) BSC 0.276 (7.0) BSC
37 36
0.030 (0.75) 0.018 (0.45)
TOP VIEW
(PINS DOWN)
0.006 (0.15) 0.002 (0.05) 0 - 7 0 MIN 0.008 (0.20) 0.004 (0.09)
12 13
25 24
0.019 (0.5) BSC
0.011 (0.27) 0.006 (0.17)
REV. PrD
-15-
0.354 (9.00) BSC
0.276 (7.0) BSC
SEATING PLANE


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